SOLIDWORKS Flow Simulation, a powerful computational fluid dynamics (CFD) tool, offers a comprehensive solution for analyzing heat transfer in various scenarios. In this blog, we’ll explore the concept of thermal joints in SOLIDWORKS Flow Simulation.
In our digitized world of smart devices that are packed with high-performance processors and memory chips, how do the devices stay cool during intense gaming sessions or video streaming? The answer lies in the inbuilt intricate thermal management systems. The Thermal Simulation of electronic components enables product engineers to visualize heat flow patterns and measure various thermal parameters.
What are SOLIDWORKS Thermal Joints?
Thermal Joints allow simulation of heat transfer from one surface to another when the surfaces are not in direct contact with each other. It allows for simulation of thermal conductance between the surfaces of disjointed parts or components. Unlike traditional modeling methods that require explicitly defining conductors, thermal joints allow us to simulate heat transfer without modeling the actual conducting component or material. Think of them as virtual (thermal) bridges connecting regions at different temperatures within a system.
Thermal Joint
The thermal joint is a fast way to represent the heat transfer between the disjoint components and users don’t have to mesh the geometry of the component that is conducting the heat. Thermal resistance or heat transfer coefficient must be specified in the Thermal Joint definition.
Component control option
In the example shown below, the thermal Joint model is defined to simplify heat transfer simulation from the top component (hot surface) to the bottom (cold surface) component using an external heat flow analysis. The component control option was used to exclude the component in between the top and bottom components.
It is important to remember that a thermal joint is used when the surfaces are not coincident or touching. If the surfaces are coincident, it would be necessary to define contact resistance instead of thermal joint.
Component control option
To simulate heat transfer between these two surfaces, the value of contact resistance was specified in the thermal joint definition. The values can be constant or varied per formula or parameters per dependency criteria.
Thermal Joint settings
A heat source of 1 W was applied on the top surface of the top component.
Heat source applied
Once the surfaces are selected to specify the thermal joint between them, they become thermally insulated with respect to the surrounding medium and only participate in the heat exchange between each other.
When processing the results, heat transfer rate and surface heat flux (convective) parameters are zero on the surface that has thermal joint conditions assigned because there is no heat transfer between the surface and surrounding medium. Heat is only exchanged between surfaces participating in the thermal joint definition. The Surface heat flux (conductive) will have a non-zero value for the surface selected in the thermal joint definition.
Cut-plot results
In the cut-plot of the temperature profile shown below, arrows represent heat flow direction.
The surface heat flux plot (conductive) is as shown below.
The most common application of thermal joints lies in predicting the cooling performance of electronic devices. They can also be used in aerodynamic or hydrodynamic applications.
With thermal joints in SOLIDWORKS Flow Simulation, we save time by not modeling the conducting component and gain confidence in temperature predictions by accounting for their virtual presence.
Learn more about Thermal Analysis and Heat Transfer
Take our SOLIDWORKS Flow Simulation training course either in-class or live online.
